| Jabil (1966) | St. Petersburg, Florida, USA | Layers: Supports complex multilayer (rigid, flex, rigid-flex), HDI Trace: Follows customer design & IPC standards (e.g., 3-4 mil) Turnaround: Quick-turn prototyping available; lead times vary | EMS, Design Engineering, Supply Chain, PCBA Miniaturization, Printed/Flexible Electronics | Global scale, integrated design-to-manufacturing, advanced automation, high reliability, supply chain expertise. | Specific manufacturing specs are project-dependent; primarily serves large OEMs. | Consumer Electronics, Automotive, Healthcare, Aerospace, Telecom | Advanced PCBA (SMT, CoB, BGA), automated end-to-end processes, custom material analysis, integrated testing. |
| Flex (1969) | Austin, Texas, USA | Layers: >30 layers, HDI, rigid-flex, microelectronics Trace: As low as 2.5 mil, design-dependent Turnaround: Project-dependent, focus on scaled production | Design & Engineering, Global Manufacturing, Supply Chain, System Integration | Massive global footprint, end-to-end product lifecycle management, cross-industry expertise, cost optimization at scale. | Less focused on small-batch, quick-turn online services; complex engagement process. | Cloud/Data Center, Automotive, Lifestyle, Health Solutions | Full-service, complex SMT, system-in-package (SiP), full system assembly and integration. |
| Sanmina (1980) | San Jose, California, USA | Layers: >40 layers, RF/Microwave, rigid-flex, optical Trace: ~3 mil for advanced designs Turnaround: Varies by project complexity and volume | High-reliability EMS, Mission-Critical Systems, RF/Optical, Precision Machining | Expertise in regulated and high-reliability markets, vertically integrated services (from components to systems). | Higher cost structure, not geared for hobbyist or simple prototype projects. | Medical imaging systems, defense communications, optical networking hardware | Class 3 PCBA, microelectronics assembly, test engineering for mission-critical applications. |
| TTM Technologies (1998) | Santa Ana, California, USA | Layers: >50 layers, HDI, any-layer, substrate-like PCB Trace: <2 mil for advanced applications Turnaround: Quick-turn prototyping to high-volume production | Advanced PCB Fabrication, RF & Microwave, HDI, Rigid-Flex, Custom Chemistries | Technology leader in advanced PCB fabrication, large volume capacity, broad technology portfolio. | Primarily a fabricator; assembly is offered but not the core focus compared to EMS giants. | 5G infrastructure, aerospace/defense radar, data center hardware, medical devices | Offers PCB assembly services to provide a single point of contact for fabrication and assembly. |
| Benchmark Electronics (1979) | Tempe, Arizona, USA | Layers: >20 layers, complex system boards Trace: Typically ~3 mil, project-specific Turnaround: Project-dependent, focus on lifecycle services | Complex product engineering, manufacturing for regulated industries, full product lifecycle services. | Full lifecycle partnership (design, test, manufacture, aftermarket), deep engineering expertise. | Not suited for simple, high-volume consumer products; focus on high-complexity, lower-volume. | Medical devices, flight control systems, semiconductor capital equipment | High-complexity PCBA, SMT, BGA, full system test and integration. |
| Sierra Circuits (1986) | Sunnyvale, California, USA | Layers: Up to 42 layers Trace: As low as 2 mil Turnaround: From 24 hours for prototypes to standard lead times | Quick-turn Prototypes, Complex Boards (HDI, flex, rigid-flex), Controlled Impedance | Exceptional speed for complex prototypes, powerful online quoting and design tools, extensive technical resources. | Not optimized for mass production scale and cost compared to large EMS providers. | IoT device prototypes, R&D projects, medical device development | Full turn-key assembly services integrated with their fast fabrication process, from 1 piece to 1000s. |
Amphenol Printed Circuits(1998) | | Layers: Up to 30 layers (standard), more for advanced PCBs Drill hole size: 4 to 7.9 mils Turnaround: Same-day to standard lead times | World PCB leader for military and commercial applications. | Global footprint, local support; Cost-effective partnership; Manufacturing versatility | High cost and longer lead time; may have a communication gap | | Full turn-key, thru hole, press fit, crimp, SMT/BGA, Wire-Bond, RoHS compliant, potting, conformal coating, Parylene coating |
| Advanced Circuits (AdvancedPCB) (1989) | Aurora, Colorado, USA | Layers: Up to 10 layers (standard), more for custom orders Trace: 4 mil minimum Turnaround: Same-day to standard lead times | Reliable PCB manufacturing, from prototype to production, strong customer support. | US-based manufacturing, very strong customer service, free design check software, no minimum order quantity. | Less focus on cutting-edge HDI or highly specialized flex circuits compared to niche specialists. | Industrial controls, test equipment, university projects, military applications | Offers full turn-key PCB assembly services, from prototype to production quantities. |
| OSH Park (2012) | Lake Oswego, Oregon, USA | Layers: 2, 4, and 6 layer options Trace: 5 mil minimum Turnaround: Fixed turnaround (~9-12 days) due to board pooling | Low-cost, small-batch prototyping, Community-focused service | Extremely low cost for small boards, high-quality finish for the price, distinctive purple soldermask, simple ordering. | Limited material/finish options, fixed slow turnaround, no assembly services offered. | Hobby projects, open-source hardware prototypes, conference badges | No assembly services offered. Fabrication only. |
| Screaming Circuits (2003) | Canby, Oregon, USA | Layers: N/A (Assembly only) Trace: N/A (Assembly only) Turnaround: From 24 hours for assembly | Quick-turn PCB Assembly, Prototype Assembly | Extremely fast assembly speed, flexibility in component sourcing (can use customer-supplied parts), online quoting. | Assembly only; does not fabricate PCBs. Customers must source boards separately. | Assembling prototypes of all kinds where speed is critical. | Core business is quick-turn PCBA. SMT, through-hole, BGA placement. Manages the entire assembly process. |